Research on the contact melting (CM) in a Cu/Al system plays an important role in developing technology for contact-reactive soldering [1-6]. Also, the data on CM may be of interest in constructing a Cu/Al system layered intermetallic composite material [7], as well as in the development of heat-dissipating devices, powerful high-frequency diodes and transistors [8]. This work attempts to reveal the structural features of the contact layers during the contact melting of copper with AMG-2 brand aluminum (with the addition of ~2 wt.% Mg, the rest aluminum) and determine the effects of the Mg impurity on the time dependence of the contact layer thickness for the Cu/Al system.

intermediate phases, contact melting, temperature, intermetallic compounds, aluminum/copper system.