JP Journal of Heat and Mass Transfer
Volume 7, Issue 1, Pages 85 - 111
(February 2013)
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NUMERICAL ANALYSIS OF CONJUGATE HEAT TRANSFER FOR CIRCULAR LIQUID MINICHANNEL
M. Khamis Mansour
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Abstract: This paper presents a numerical study to investigate the effect of the heat flux magnitude on the heat transfer characteristics for three-dimensional laminar flow through circular minichannel using liquid as the cooling medium. A uniform heat flux is applied at the bottom side of the substrate while the topside surface is considered as an adiabatic surface. The other two sides are considered as symmetrical surfaces. The study shows, when the minichannel is exposed to high heat flux; its thermal characteristics are contradictory to what is expected when it is subjected to low heat flux. The thermal characteristics in this study are represented by the average heat transfer coefficient and the average bottom surface temperature for the minichannel. The exposure of high heat flux tends to make the temperature around the channel periphery is not uniform even though a high conductive material is used. The theoretical model has been verified by comparing the predicated results with those obtained from the available analytical and experimental data. In order to investigate the effect of the substrate thermal conductivity on the heat transfer characteristics for the minichannel, three different solid materials are addressed: copper silicon and stainless steel The analysis for the minichannel has been conducted with three different cooling liquids: mercury, water and engine-oil. The silicon minichannel with using water as the cooling medium has been taken as the base study. |
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