JP Journal of Heat and Mass Transfer
Volume 3, Issue 2, Pages 117 - 129
(June 2009)
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STUDY ON THE HEAT SINK PERFORMANCE FOR LSI PACKAGES USING A THERMO-SIPHON STRUCTURE WITH PF-5060 REFRIGERANTS
Masaru Ishizuka (Japan), Shinji Nakagawa (Japan), Yuichi Funawatashi (Japan) and Tomoyuki Hatakeyama (Japan)
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Abstract: Design features and experimental results are presented for a heat sink with the thermo-siphon structure for cooling multi-chip modules. The prototype heat sink is made, which consists of copper tubes, stainless container, PF-5060 as a coolant and rubber heaters for simulating multi-chip modules, and some basic experiments are carried out to obtain the cooling performance of the heat sink with the thermo-siphon structure. In this study, it is found that the thermal resistance values of 0.4-0.5 C/W at the heat dissipation range of 9.4-43.0 watts, under the condition of uniform air velocity of 2.6 m/s, are obtained. |
Keywords and phrases: natural convection, heat transfer, heat flux, heat exchange, electronic equipment cabinet model. |
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