JP Journal of Heat and Mass Transfer
Volume 2, Issue 3, Pages 259 - 277
(October 2008)
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THERMAL PERFORMANCE OF A FORCED CONVECTION AIR COOLED PBGA PACKAGE IN A COMPACT THIN CASING
Masaru Ishizuka (Japan), Shinji Nakagawa (Japan), Yasushi Nishino (Japan), Takashi Fukue (Japan) and Kazuyuki Nakayama (Japan)
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Abstract: At the PC design stage, heat flow analysis in a PC is needed. However, due to the complex printed wiring board structure, a large number of grids are required to enable precise calculation, ruling out calculations using a conventional PC. This has led to attempts to predict the temperature of an actual package by calculation based on a simplified package whose result is then modified.
In this study, a compact casing and a package model are used to simulate actual notebook PCs. The performance of a diode package is experimentally obtained, and the flow inside the casing and the thermal performance of the package are studied with an obstacle placed inside the casing. |
Keywords and phrases: data requisition, thermal performance, forced air PBGA package, compact thin casing, CFD simulations. |
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